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TS series

Products using high thermal conductivity aluminum substrate, could achieve the small angle, high power density, high center strength output with high product reliability;


High luminous efficiency;  Adopt flip chip, formal chip, CSP design;


Product light spot is uniform without dark spots,yellow spots, stripes and other problems.



Features

High efficiency, high reliability

High RA data

High power density


Datasheet:
Part No.Size(mm)LES(mm)Power(W)If(mA)Vf(V)CCT(K)η(lm/W)Flux(lm)RaSpecification
TS009-254L626L-01WDGD32*32*1.0φ2114-19W44003.22700-6500K115-1251600-175070+

TS009-254L626L-01WDGD.pdf

TS012-254H626H-02GDGD115*28*1.595*1516-20W26006.22700-6500K110-1351800-220080+

TS012-254H626H-02GDGD.pdf

TS005-30L60L-0620GX160*40*1.6φ3036-52W600603000-6000K120-1304300-468070+

TS005-30L60L-0620GX1.pdf

TS020-30L60L-0250CX1137*22*1.2112*1145-60W3001503000-6000K110-1154900-510070+

TS020-30L60L-0250CX1.pdf